What is QFN component?

What is QFN component?

QFN Package Overview QFN is a lead frame-based package which is also called CSP (Chip Scale Package) with the ability to view and contact leads after assembly. QFN packages typically use a copper lead frame for the die assembly and PCB interconnection. The QFN can have a single or a multiple rows of pins.

What is the difference between QFN and DFN?

The DFN is similar to the QFN, except that the latter has lands all around the periphery of the package instead of just two sides like the DFN. Because the DFN has no leads and has shorter bond wire lengths, it provides a higher electrical performance than leaded packages due to less inductance.

What is leadless package?

1. Introduction. The Leadless Leadframe Package (LLP) is a leadframe based chip scale package (CSP) that may enhance chip speed, reduce thermal impedance, and reduce the printed circuit board area required for mounting.

What is QFP and QFN?

The most common IC package types for larger critical components such as microcontrollers are the QFP (Quad Flat Package) and QFN (Quad Flat No-leads) packages. The need for X-Ray Inspection increases the cost of assembly for QFN parts compared to their QFP counterparts.

What is a BGA package?

(Ball Grid Array) A popular surface mount chip package that uses a grid of solder balls as its connectors. Available in plastic and ceramic varieties, BGA is noted for its compact size, high lead count and low inductance, which allows lower voltages to be used. See surface mount, chip package, MicroBGA and flip chip.

What does Vqfn stand for?


Acronym Definition
VQFN Very Thin Quad Flat Non-Leaded Package

What is Wson package?

WSON. Very-very-thin small-outline no-lead package.

What is Lfcsp package?

Description. The LFCSP is a near chip scale package (CSP), a plastic encapsulated wire bond package with a copper lead frame substrate in a leadless package format. Heat is efficiently conducted from the package by soldering the exposed thermal paddle (see Figure 1) to the PCB.

What does TQFP stand for?

thin quad flat pack
A thin quad flat pack (TQFP) provides the same benefits as the metric QFP, but is thinner. Regular QFP are 2.0 to 3.8 mm thick depending on size. TQFP packages range from 32 pins with a 0.8 mm lead pitch, in a package 5 mm by 5 mm by 1 mm thick, to 256 pins, 28 mm square, 1.4 mm thick and a lead pitch of 0.4 mm.

What is LBGA?

LBGA [Low-Profile Ball Grid Array] is a surface mount package with a low profile that uses solder balls to attach to the Printed Wiring Board [PWB] or BGA socket. So an LBGA takes up the same physical space on a PWB as a BGA [of the same size], but is not as high off the board.

What is the purpose of BGA?

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.

What is the purpose of Bumpered corners of the Bumpered quad flat pack?

A clear variation is bumpered quad flat package (BQFP) with extensions at the four corners to protect the leads against mechanical damage before the unit is soldered.

Which is Quad Flat no lead ( QFN ) package?

Quad flat no lead (QFN) packages offer a leadless, small package size with a thermal pad giving good thermal performance. These are low profile, miniature devices in a robust, plastic package compatible with all end equipment including automotive. Dual lead version is referred to as SON.

What does QFN stand for in PCB category?

QFN stands for quad flat no-lead package. It is a leadless package that comes in small size and offers moderate heat dissipation in PCBs. Like any other IC package, the function of a QFN package is to connect the silicon die of the IC to the circuit board. The QFN packages come with a die that is surrounded by a lead frame.

What are the characteristics of a QFN package?

QFN Electrical Characteristics Thermal pad, or exposed pad, is an efficient method of drawing heat from the die to the PCB. QFN is a thermal efficient package and the exposed pad is a very cost-effective solution. QFNs can handle up to 2W-3W without forced air cooling.

What are the advantages of a QFN / son?

QFN/SONs are packages with a plastic small outline and no lead, with no lead extending beyond the package body. The contact pads are exposed and flush with the bottom of the package. What are the advantages of QFN/SON?