What is sputtering rate?

What is sputtering rate?

The sputtering “Yield” calculation data in the third column represents the number of target atoms sputtered (ejected from the target) per argon ion striking the target with a kinetic energy of 600 ev. This energy is typical for an Argon plasma.

How do you calculate sputtering yield?

It is found that the elemental and compound data expressed as the yields, Y, of atoms sputtered per primary ion may all be described by a simple universal equation: Y/n = (E/An)q/[1 + (E/An)q−1] where the parameters A and q are established by fitting.

How can I increase my sputter rate?

For a given power density (see Power & Power Density), the larger the target diameter the higher the sputter rate. The explanation is simple. A larger target diameter means a larger sputter trench area and, for a given power density, increased trench area means increased sputter rate.

What is argon sputtering?

The sputtering, in a space filled with inert gas such as Ar (argon), argon is atomized by discharging a high voltage to the material (target), it is knocked out the target atom by colliding with the target, It is a technology that adheres to the substrate and forms a thin film.

Why is it called sputtering?

Such cascades can take many paths; some recoil back toward the surface of the target. If a collision cascade reaches the surface of the target, and its remaining energy is greater than the target’s surface binding energy, an atom will be ejected. This process is known as “sputtering”.

What is purpose of sputtering?

Sputtering is a Physical Vapor Deposition vacuum process used to deposit very thin films onto a substrate for a wide variety of commercial and scientific purposes. Sputtering occurs when an ionized gas molecule is used to displace atoms of a specific material.

What is meant by sputtering?

1 : to spit or squirt from the mouth with explosive sounds. 2 : to utter hastily or explosively in confusion or excitement “that’s ridiculous!” she sputtered. 3 : to dislodge (atoms) from the surface of a material by collision with high energy particles also : to deposit (a metallic film) by such a process.

Why do we use sputtering?

Sputtering is used extensively in the semiconductor industry to deposit thin films of various materials in integrated circuit processing. Because of the low substrate temperatures used, sputtering is an ideal method to deposit contact metals for thin-film transistors.

What is the principle of sputtering?

The principle of Sputtering is to use the energy of a plasma (partially ionized gas) on the surface of a target (cathode), to pull the atoms of the material one by one and deposit them on the substrate.

What is a sputter tool?

Sputter deposition is a PVD method of depositing thin films by plasma sputtering. Sputtering effectively “knocks off” the material to be sputtered via a high energy, ionized atom (typically Ar).

How is sputtering done?

Sputtering is a plasma based deposition process in which energetic ions are accelerated towards a target. The ions strike the target and atoms are ejected (or sputtered) from the surface. These atoms travel towards the substrate and incorporate into the growing film.

How is the yield of a sputtering ion determined?

Sputter yield is defined by how many atoms can be ejected from the target per sputtering ion (Sy =target atom per sputtering ion). This yield depends on the respective masses ( Mtarget, Mions ), the energy of the ion, Eion, and the bonding energy of the target material, Ebind.

How much energy is needed for knock-on sputtering?

Knock-on sputtering: ion energies in the range of ~10 eV to 1 keV are of prime interest for commercial and industrial applications of sputtering.

Which is an inert gas used for sputtering?

The sputtering o f materials using inert gas primary ions, particularly argon, is a routine part of surface and thin film analysis for compositional depth profiling using Auger electron spectroscopy (AES) or X-ray photoelectron spectroscopy (XPS) [1,2]. Other inert gases a re also used to improve the depth

How much does a sputtering yield increase per inch?

Decrease by approximately 25% per inch beyond the 4″ source to substrate distance. Increase by approximately 35% per inch closer than the 4″ substrate distance. * The above sputtering yield rates are provided as a comparison. Specific thin film deposition rate calculations will vary based upon PVD coating system design and process parameters.